High Temperature Adhesive Tape for Electronics Industry

Composition and Structure
Base Material: Commonly used base materials include polyimide (PI), polyethylene terephthalate (PET), and fluoropolymer films. These materials offer excellent heat resistance, mechanical strength, and electrical insulation properties. For example, polyimide films can withstand high temperatures up to 260°C or more, making them suitable for applications in high - temperature environments.
Adhesive Layer: The adhesive used is typically a heat - resistant acrylic or silicone - based adhesive. Acrylic - based adhesives provide good adhesion and chemical resistance, while silicone - based adhesives offer better heat resistance and flexibility. The adhesive layer is designed to bond firmly to the substrate and the adhered object, ensuring reliable attachment even at high temperatures.

High Temperature Adhesive Tape for Electronics Industry Features

High - Temperature Resistance: It can maintain stable performance within a wide temperature range, usually from - 55°C to + 200°C or higher, depending on the specific type of tape.
Good Electrical Insulation: It has excellent electrical insulation properties to prevent short - circuits and electrical interference between different components. The volume resistivity of the tape is usually very high, on the order of 10¹³ - 10¹⁶ Ω·cm, ensuring reliable insulation in electronic devices.
Strong Adhesion: It provides strong and durable adhesion to a variety of substrates, including metals, plastics, and ceramics. The peel strength can reach several N/cm or more, ensuring that the tape remains firmly in place during the manufacturing process and the use of electronic products.
Chemical Resistance: It is resistant to common chemicals such as solvents, acids, and alkalis, which may be encountered during the manufacturing process of electronic devices.

High Temperature Adhesive Tape for Electronics Industry Applications

Top Applications in Electronics Manufacturing

PCB Solder Masking – Protects areas from solder during reflow/wave soldering.
Wire & Cable Bundling – Secures high-temp wiring in automotive/aerospace.
Thermal Insulation – Shields sensitive components from heat sources.
EMI Shielding – Aluminum or copper tapes for grounding & interference blocking.
Component Fixation – Holds parts in place during curing/coating processes.